FRACTURE-TOUGHNESS OF SILICON

被引：0

作者：

CHEN, CP

LEIPOLD, MH

机构：

来源：

AMERICAN CERAMIC SOCIETY BULLETIN | 1980年 / 59卷 / 04期

关键词：

D O I：

暂无

中图分类号：

TQ174 [陶瓷工业]; TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

The purpose of the present study was to determine the fracture toughness and to characterize fracture modes of silicon as a function of the orientation of single-crystal and polycrystalline material. Silicon is used in manufacture of solar cells and other photovoltaic sensors.

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页码：469 / 472

页数：4

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