ELECTRODEPOSITION OF COPPER IN THE PRESENCE OF CADMIUM

被引：18

作者：

BUDNIOK, A

GALA, J

PLUTA, I

机构：

[1] Institute of Physics and Chemistry of Metals, Silesian University, Katowice

来源：

ELECTROCHIMICA ACTA | 1979年 / 24卷 / 12期

关键词：

D O I：

10.1016/0013-4686(79)87080-2

中图分类号：

O646 [电化学、电解、磁化学];

学科分类号：

081704 ;

摘要：

A study was made of the effect of cadmium concentration on the process of copper electrocrystallization from an ethylenediamine electrolyte on the (111) crystallographic plane of a copper single crystal. It was shown that a relation exists between superpolarization and depolarization of deposition of Cu-Cd alloy components, and cadmium underpotential adsorption or underpotential deposition. This relation was also detected by the influence exerted on the kinetic parameters of the given model of Cu-Cd alloy nucleation and growth. © 1979.

引用

页码：1247 / 1252

页数：6

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