ELECTRODEPOSITION OF COPPER IN THE PRESENCE OF CADMIUM

被引：18
作者：
BUDNIOK, A
GALA, J
PLUTA, I
机构：
[1] Institute of Physics and Chemistry of Metals, Silesian University, Katowice
来源：
ELECTROCHIMICA ACTA | 1979年 / 24卷 / 12期
关键词：
D O I：
10.1016/0013-4686(79)87080-2
中图分类号：
O646 [电化学、电解、磁化学];
学科分类号：
081704 ;
摘要：
A study was made of the effect of cadmium concentration on the process of copper electrocrystallization from an ethylenediamine electrolyte on the (111) crystallographic plane of a copper single crystal. It was shown that a relation exists between superpolarization and depolarization of deposition of Cu-Cd alloy components, and cadmium underpotential adsorption or underpotential deposition. This relation was also detected by the influence exerted on the kinetic parameters of the given model of Cu-Cd alloy nucleation and growth. © 1979.
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页码：1247 / 1252
页数：6
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