LOW MOLD STRESS EPOXY MOLDING COMPOUNDS FOR SEMICONDUCTOR ENCAPSULATION

被引：0
|
作者：
SUZUKI, H [1 ]
MORIUCHI, T [1 ]
AIZAWA, M [1 ]
机构：
[1] NITTO ELECT IND CO LTD,DEPT PLAST PACKAGE SEMICOND DEV,KAMEYAMA,MIE,JAPAN
来源：
JOURNAL OF THE ELECTROCHEMICAL SOCIETY | 1979年 / 126卷 / 03期
关键词：
D O I：
暂无
中图分类号：
O646 [电化学、电解、磁化学];
学科分类号：
081704 ;
摘要：
引用
收藏
页码：C119 / C119
页数：1
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