METALLURGICAL STUDY OF FLIP-CHIP BONDING

被引：0

作者：

OHARA, H

SATO, K

KAMOSHIT.G

机构：

来源：

METALLURGICAL TRANSACTIONS | 1970年 / 1卷 / 03期

关键词：

D O I：

10.1007/BF02811595

中图分类号：

TF [冶金工业];

学科分类号：

0806 ;

摘要：

引用

页码：679 / &

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