METALLURGICAL STUDY OF FLIP-CHIP BONDING

被引：0
作者：
OHARA, H
SATO, K
KAMOSHIT.G
机构：
来源：
METALLURGICAL TRANSACTIONS | 1970年 / 1卷 / 03期
关键词：
D O I：
10.1007/BF02811595
中图分类号：
TF [冶金工业];
学科分类号：
0806 ;
摘要：
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页码：679 / &
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