ELECTROLESS GOLD PLATING BY DISULFITEAURATE COMPLEX

被引：0
作者：
HONMA, H
HASEGAWA, A
HOTTA, S
HAGIWARA, K
机构：
来源：
PLATING AND SURFACE FINISHING | 1995年 / 82卷 / 04期
关键词：
D O I：
暂无
中图分类号：
TF [冶金工业];
学科分类号：
0806 ;
摘要：
Non-cyanide electroless gold plating, using a disulfiteaurate complex, is unsatisfactory because the complex is unstable and easily decomposes. Bath stability was improved by using Na2SO3,Na2S2O3 and nitrilotriacetic acid as complexing agents; the disproportionation reaction of gold(I) ions was suppressed by the addition of cupferron, bipyridine or Ni(CN)(2) . 2KCN. The plating rate ranged from 0.7 to 1.0 mu m/hr with sodium ascorbate as a reducing agent. The rate was increased to about 1.5 to 2.0 mu m/hr with the addition of sodium ascorbate and hydrazine sulfate. Based on these results, gold wire bondability was evaluated. Gold crystal orientation was influenced by the wire bonding, and high bonding strength was obtained with (220) and (311) preferred orientation gold films.
引用
收藏
页码：89 / 92
页数：4
相关论文
共 50 条
[21]   New technology of electroless gold plating on PCB [J].
Dianzi Keji Diaxue Xuebao, 6 (658-661)
[22]   Electroless nickel/gold plating on copper based semiconductors [J].
Strandjord, AJG ;
Popelar, SF ;
Erickson, CA .
2000 INTERNATIONAL SYMPOSIUM ON MICROELECTRONICS, 2000, 4339 :196-201
[23]   Factors influencing the electroless gold plating for ceramic packaging [J].
Zhang, Lei ;
Liu, Sheng-Qian ;
Liu, Qiao-Ming .
ICEPT: 2007 8TH INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING TECHNOLOGY, PROCEEDINGS, 2007, :463-465
[24]   Fabrication of patterned gold microstructure by selective electroless plating [J].
Guan, F ;
Chen, MA ;
Yang, W ;
Wang, JQ ;
Yong, SR ;
Xue, QJ .
APPLIED SURFACE SCIENCE, 2005, 240 (1-4) :24-27
[25]   Electroless Plating with Copper Complex Ink as a Seed [J].
Chew, KaiHwa ;
Farraj, Yousef ;
Magdassi, Shlomo .
2020 IEEE 22ND ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE (EPTC), 2020, :36-40
[26]   Complex chemistry & the electroless copper plating process [J].
Li, J ;
Kohl, PA .
PLATING AND SURFACE FINISHING, 2004, 91 (02) :40-46
[27]   An electroless plating method for conducting microbeads using gold nanoparticles [J].
Yamamoto, Yojiro ;
Takeda, Shintaro ;
Shiigi, Hiroshi ;
Nagaoka, Tsutomu .
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 2007, 154 (09) :D462-D466
[28]   Evaluation of substrate (Ni)-catalyzed electroless gold plating process [J].
Osaka, T ;
Misato, T ;
Sato, J ;
Akiya, H ;
Homma, T ;
Kato, M ;
Okinaka, Y ;
Yoshioka, O .
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 2000, 147 (03) :1059-1064
[29]   The inhibition of silver agglomeration by gold activation in silver electroless plating [J].
Cha, SH ;
Koo, HC ;
Kim, JJ .
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 2005, 152 (06) :C388-C391
[30]   On-line chemical sensors for electroless gold plating. [J].
Sadik, O ;
Xu, HW .
ABSTRACTS OF PAPERS OF THE AMERICAN CHEMICAL SOCIETY, 2001, 221 :U582-U583
12345