PASSIVE AND ACTIVE FIBEROPTIC COMPONENTS LINK UP IN IOCS

被引:0
|
作者
SRIRAM, S
WOOD, VE
BUSCH, JR
RIDGWAY, RW
SMITH, BT
MIYASHITA, T
机构
[1] BATTELLE COLUMBUS DIV, 505 KING AVE, COLUMBUS, OH 43201 USA
[2] PHOTON INTEGRAT RES INC, COLUMBUS, OH 43201 USA
来源
LASER FOCUS-ELECTRO-OPTICS | 1988年 / 24卷 / 09期
关键词
D O I
暂无
中图分类号
O43 [光学];
学科分类号
070207 ; 0803 ;
摘要
引用
收藏
页码:95 / +
页数:1
相关论文
共 50 条
  • [1] PASSIVE COMPONENTS FOR MULTIMODE FIBEROPTIC NETWORKS
    SEVERIN, PJ
    SEVERIJNS, AP
    VANBOMMEL, CH
    JOURNAL OF LIGHTWAVE TECHNOLOGY, 1986, 4 (05) : 490 - 496
  • [2] Passive components handle many fiberoptic tasks
    Hecht, J
    LASER FOCUS WORLD, 2001, : 95 - 98
  • [3] Passive components handle many fiberoptic tasks
    Hecht, J
    LASER FOCUS WORLD, 1999, 35 (05): : 243 - +
  • [4] Passive components handle many fiberoptic tasks
    2001, PennWell Publishing Co. (37):
  • [5] Integration of passive and active components into build-up layers
    Ostmann, A
    Neumann, A
    Auersperg, J
    Ghahremani, C
    Sommer, G
    Aschenbrenner, R
    Reichl, H
    PROCEEDINGS OF THE 4TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE (EPTC 2002), 2002, : 223 - 228
  • [6] FIBEROPTIC LINK-UP FOR FRENCH RESEARCH
    SMITH, B
    PHYSICS WORLD, 1991, 4 (04) : 7 - 7
  • [7] Gaussian optics application in passive fiberoptic components design
    Huang, R
    Li, HS
    APOC 2001: ASIA-PACIFIC OPTICAL AND WIRELESS COMMUNICATIONS: OPTICAL FIBER AND PLANAR WAVEGUIDE TECHNOLOGY, 2001, 4579 : 122 - 129
  • [8] PASSIVE FIBEROPTIC COMPONENTS MADE BY THE FUSED BICONICAL TAPER PROCESS
    TEKIPPE, VJ
    FIBER AND INTEGRATED OPTICS, 1990, 9 (02) : 97 - 123
  • [9] ACTIVE AND PASSIVE FIBER COMPONENTS
    STEWART, WJ
    PHILOSOPHICAL TRANSACTIONS OF THE ROYAL SOCIETY A-MATHEMATICAL PHYSICAL AND ENGINEERING SCIENCES, 1989, 329 (1603): : 139 - 142
  • [10] A Compositional Approach to Active and Passive Components
    Lau, Kung-Kiu
    Ntalamagkas, Ioannis
    PROCEEDINGS OF THE 34TH EUROMICRO CONFERENCE ON SOFTWARE ENGINEERING AND ADVANCED APPLICATIONS, 2008, : 76 - 83