APPLICATION OF POTENTIOMETRIC TITRATION TO THE ANALYSIS OF ELECTROLESS COPPER-PLATING SOLUTIONS

被引:0
作者
KITAEV, GA
DASHKO, LN
机构
关键词
D O I
暂无
中图分类号
O69 [应用化学];
学科分类号
081704 ;
摘要
The possibility of applying potentiometric titration to the analysis of multicomponent electroless copper-plating solutions has been considered using copper-plating solution containing the copper(II) salt, alkali, sodium carbonate, and K,Na tartrate as its basic ingredients, as an example.
引用
收藏
页码:443 / 448
页数:6
相关论文
共 50 条
[41]   Surface plasma functionalization of polycarbonate: Application to electroless nickel and copper plating [J].
M. Charbonnier ;
M. Romand ;
E. Harry ;
M. Alami .
Journal of Applied Electrochemistry, 2001, 31 :57-63
[42]   Influence of technological factors on the productivity of drawing and copper-plating lines [J].
Saltuk V.N. ;
Klekovkina N.A. ;
Ryn'Kova E.V. ;
Portsman Yu.N. ;
Ptashinskaya A.A. .
Steel in Translation, 2007, 37 (07) :637-639
[43]   DISPERSIBILITY OF COPPER-PLATING SULFATE ELECTROLYTES CONTAINING NITRATE IONS [J].
BRAUN, EV ;
SAVELEV, MI ;
KRUGLIKOV, SS ;
YARLYKOV, MM ;
MYAGKOVA, SI .
PROTECTION OF METALS, 1988, 24 (02) :238-240
[44]   Preparation technique for copper-plating on Si nanoporous pillar array [J].
Yang, Xiao Hui ;
Jiang, Wei Fen ;
Li, Xin Jian .
THIN SOLID FILMS, 2010, 518 (23) :6866-6869
[45]   Carbohydrates. (IX) The copper-plating of poly-alcohols [J].
Lieser, T ;
Ebert, R .
JUSTUS LIEBIGS ANNALEN DER CHEMIE, 1937, 532 :89-94
[46]   Study of EDTA complexed electroless copper plating for ULSI and electronics application [J].
Chi, IH ;
Lee, JH .
EPD CONGRESS 2001, 2001, :753-760
[47]   Surface plasma functionalization of polycarbonate: Application to electroless nickel and copper plating [J].
Charbonnier, M ;
Romand, M ;
Harry, E ;
Alami, M .
JOURNAL OF APPLIED ELECTROCHEMISTRY, 2001, 31 (01) :57-63
[48]   Electroless Plating Copper on SIC particles [J].
Zhang, Jian ;
Wang, Xinguo ;
Zhao, Longzhi ;
Zhao, Mingjuan .
CHEMICAL, MATERIAL AND METALLURGICAL ENGINEERING III, PTS 1-3, 2014, 881-883 :1053-1057
[49]   Electroless plating of graphite with copper and nickel [J].
Caturla, F ;
Molina, F ;
MolinaSabio, M ;
RodriguezReinoso, F ;
Esteban, A .
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1995, 142 (12) :4084-4090
[50]   Regeneration of a Solution for Electroless Copper Plating [J].
D. Yu. Turaev ;
S. S. Kruglikov .
Russian Journal of Applied Chemistry, 2005, 78 :579-583