共 50 条
[41]
Surface plasma functionalization of polycarbonate: Application to electroless nickel and copper plating
[J].
Journal of Applied Electrochemistry,
2001, 31
:57-63
[43]
DISPERSIBILITY OF COPPER-PLATING SULFATE ELECTROLYTES CONTAINING NITRATE IONS
[J].
PROTECTION OF METALS,
1988, 24 (02)
:238-240
[45]
Carbohydrates. (IX) The copper-plating of poly-alcohols
[J].
JUSTUS LIEBIGS ANNALEN DER CHEMIE,
1937, 532
:89-94
[46]
Study of EDTA complexed electroless copper plating for ULSI and electronics application
[J].
EPD CONGRESS 2001,
2001,
:753-760
[48]
Electroless Plating Copper on SIC particles
[J].
CHEMICAL, MATERIAL AND METALLURGICAL ENGINEERING III, PTS 1-3,
2014, 881-883
:1053-1057
[50]
Regeneration of a Solution for Electroless Copper Plating
[J].
Russian Journal of Applied Chemistry,
2005, 78
:579-583