RHEOLOGY OF CURING THERMOSETS - A REVIEW

被引:99
作者
ROLLER, MB [1 ]
机构
[1] MOBIL CHEM CO,PRINCETON,NJ 08540
关键词
D O I
10.1002/pen.760260610
中图分类号
TQ [化学工业];
学科分类号
0817 ;
摘要
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页码:432 / 440
页数:9
相关论文
共 35 条
[1]  
AUNG W, 1973, JUN P INT EUR 73 BRU, P13
[4]  
Castro J. M., 1980, SPE ANTEC TECH PAPER, V26, P434
[5]   THE ROLE OF BOUNDARY-LAYER CAPACITANCE AT BLOCKING ELECTRODES IN THE INTERPRETATION OF DIELECTRIC CURE DATA IN ADHESIVES [J].
DAY, DR ;
LEWIS, TJ ;
LEE, HL ;
SENTURIA, SD .
JOURNAL OF ADHESION, 1985, 18 (01) :73-90
[6]  
DUSI MR, 1983, ACS SYM SER, V227, P301
[7]  
ELEY RR, 1983, ACS SYM SER, V227, P281
[8]  
Engelmaier Werner, 1973, 1973 11th Electrical Insulation Conference (EIC), P208, DOI 10.1109/EIC.1973.7468688
[9]  
ENGELMAIER W, 1975, FEB P NEPCON AN, P86
[10]   TIME TEMPERATURE TRANSFORMATION (TTT) CURE DIAGRAM - MODELING THE CURE BEHAVIOR OF THERMOSETS [J].
ENNS, JB ;
GILLHAM, JK .
JOURNAL OF APPLIED POLYMER SCIENCE, 1983, 28 (08) :2567-2591