POLYMER ABLATION WITH A HIGH-POWER EXCIMER-LASER TOOL

被引：5
|
作者：
WOLBOLD, GE
TESSLER, CL
TUDRYN, DJ
机构：
[1] IBM Technology Products, Hopewell Junction
来源：
MICROELECTRONIC ENGINEERING | 1993年 / 20卷 / 1-2期
关键词：
LASER ABLATION; EXCIMER LASER; VIA FORMATION PACKAGING; PROCESSING POLYMERS; DIELECTRIC MASK;
D O I：
10.1016/0167-9317(93)90203-H
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
A high-power excimer laser projection ablation tool and process in a manufacturing line is described. The light source is a 150 W XeCl (308 nm) gas laser. The projection ablation unit is very similar to that of a photo expose tool and comparisons will be made. The laser, beam delivery system, projection optics, beam homogenization, system accuracy (overlay), tool, process, operation, control, and system reliability will be discussed.
引用
收藏
页码：3 / 14
页数：12
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