Inspection of Packaged Integrated Circuits using Terahertz Radiation

被引：0

作者：

Fritz, Andreas ^{[1
]}

Arnold, Thomas ^{[1
]}

机构：

[1] CTR Carinthian Tech Res AG, Villach, Austria

来源：

INTERNATIONAL JOURNAL ON SMART SENSING AND INTELLIGENT SYSTEMS | 2014年 / 7卷 / 05期

关键词：

terahertz; Time domain spectroscopy; Wavelet transformation; Wavelet denosing; packaged integrated circuit inspection;

D O I：

10.21307/ijssis-2019-056

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

A non-destructive, non-contact inspection system for packaged integrated circuits using terahertz (THz) radiation is tested. Our results show that we are able to reconstruct the internal structure of the IC, like the microelectronic chip and the interconnections. Due to the limitation of the system and the wavelength of THz radiation the fine bonding wires could not be detected. However, we show that the THz technology will be a valuable tool for the automatic online inspection of packaged integrated circuits.

引用

页数：4

共 5 条

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Yasui, T
Yasuda, T
Sawanaka, K
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