INDUSTRIAL APPLICATIONS OF LOW-TEMPERATURE PLASMA PHYSICS

被引：97
作者：
CHEN, FF
机构：
[1] University of California, Los Angeles
来源：
PHYSICS OF PLASMAS | 1995年 / 2卷 / 06期
关键词：
D O I：
10.1063/1.871477
中图分类号：
O35 [流体力学]; O53 [等离子体物理学];
学科分类号：
070204 ; 080103 ; 080704 ;
摘要：
The application of plasma physics to the manufacturing and processing of materials may be the new frontier of our discipline. Already partially ionized discharges are used in industry, and the performance of plasmas has a large commercial and technological impact. However, the science of low-temperature plasmas is not as well developed as that of high-temperature, collisionless plasmas. In this paper several major areas of application are described and examples of forefront problems in each are given. The underlying thesis is that gas discharges have evolved beyond a black art, and that intellectually challenging problems with elegant solutions can be found. © 1995 American Institute of Physics.
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页码：2164 / 2175
页数：12
相关论文
共 46 条
[1]  
Coburn J.W., Winters H.F., J. Appl. Phys., 50, (1979)
[2]  
Coburn J.W., Plasma Etching and Reactive Ion Etching, (1982)
[3]  
Flamm D.L., Plasma Etching, (1989)
[4]  
Van Roosmalen A.J., Baggerman J.A.G., Brader S.J.H., Dry Etching for VLSI, (1991)
[5]  
Gottscho R.A., Jurgensen C.W., Vitkavage D.J., J. Vac. Sci. Technol. B., 10, (1992)
[6]  
Selwyn G.S., Heidenreich J.E., Haller K.L., Appl. Phys. Lett., 57, (1990)
[7]  
Garscadden A., Ganguly B.N., Haaland P.D., Williams J., Plasma Sources Sci. Technol., 3, (1994)
[8]  
Anderson H.M., Radovanov S., Mock J.L., Resnick P.J., Plasma Sources Sci. Technol., 3, (1994)
[9]  
Selwyn G.S., Plasma Sources Sci. Technol., 3, (1994)
[10]  
Selwyn G.S., (1994)
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