A STUDY OF INTER-DIFFUSION IN MULTILAYER CU/NI FILMS BY AUGER-ELECTRON DEPTH PROFILING

被引：19

作者：

ROLL, K

REILL, W

机构：

来源：

THIN SOLID FILMS | 1982年 / 89卷 / 02期

关键词：

D O I：

10.1016/0040-6090(82)90452-7

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

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页码：221 / 224

页数：4

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