A STUDY OF INTER-DIFFUSION IN MULTILAYER CU/NI FILMS BY AUGER-ELECTRON DEPTH PROFILING

被引：19
作者：
ROLL, K
REILL, W
机构：
来源：
THIN SOLID FILMS | 1982年 / 89卷 / 02期
关键词：
D O I：
10.1016/0040-6090(82)90452-7
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
引用
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页码：221 / 224
页数：4
相关论文
共 11 条
[1]   STUDY OF INTERFACIAL REACTIONS IN BIMETALLIC THIN-FILM COUPLES BY CONTACT RESISTANCE MEASUREMENTS [J].
BAUER, CL ;
JORDAN, AG .
PHYSICA STATUS SOLIDI A-APPLIED RESEARCH, 1978, 47 (01) :321-328
[2]  
CHUANG TJ, 1979, SURF SCI, V81, P355, DOI 10.1016/0039-6028(79)90105-5
[3]   FORMALISM FOR EXTRACTING DIFFUSION-COEFFICIENTS FROM CONCENTRATION PROFILES [J].
HALL, PM ;
MORABITO, JM .
SURFACE SCIENCE, 1976, 54 (01) :79-90
[4]   DEPTH RESOLUTION AND SURFACE-ROUGHNESS EFFECTS IN SPUTTER PROFILING OF NICR MULTILAYER SANDWICH SAMPLES USING AUGER-ELECTRON SPECTROSCOPY [J].
HOFMANN, S ;
ERLEWEIN, J ;
ZALAR, A .
THIN SOLID FILMS, 1977, 43 (03) :275-283
[5]   EFFECT OF MICROSTRUCTURE ON INTERDIFFUSION IN BIMETALLIC CU-NI THIN-FILMS [J].
JOHNSON, BC ;
BAUER, CL ;
JORDAN, AG .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY, 1979, 16 (02) :128-129
[6]   DETERMINATION OF THE DEPTH RESOLUTION IN AUGER DEPTH PROFILING MEASUREMENTS [J].
ROLL, K ;
HAMMER, C .
THIN SOLID FILMS, 1979, 57 (02) :209-212
[7]  
SHIKATA M, 1980, SURF SCI, V97, pL363, DOI 10.1016/0039-6028(80)90664-0
[8]   STUDY OF PREFERENTIAL SPUTTERING ON BINARY ALLOY BY INSITU AUGER MEASUREMENT OF SPUTTERED AND SPUTTER-DEPOSITED SURFACES [J].
SHIMIZU, R ;
SAEKI, N .
SURFACE SCIENCE, 1977, 62 (02) :751-755
[9]   INTER-DIFFUSION OF THIN BILAYERS OF COPPER AND NICKEL [J].
SUNI, I ;
NICOLET, MA ;
MAENPAA, M .
THIN SOLID FILMS, 1981, 79 (01) :69-73
[10]   EFFECT OF INTERDIFFUSION ON MOIRE PATTERNS OF THIN BIMETALLIC FILMS [J].
VANDIJK, T ;
MITTEMEIJER, EJ .
THIN SOLID FILMS, 1977, 41 (02) :173-178
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