EXTRAORDINARY ADHESION OF A SIMPLE NIOBIUM METAL-BONDING STRUCTURE

被引：5

作者：

CHEN, HS

BACON, DD

LAW, HH

KAMMLOTT, GW

WU, TC

机构：

[1] AT&T Bell Laboratories, Murray Hill, New Jersey

来源：

JOURNAL OF MATERIALS RESEARCH | 1995年 / 10卷 / 11期

关键词：

D O I：

10.1557/JMR.1995.2870

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Extraordinary adhesion of a Nb-based/Au-Sn metallization structure on a SiO2/Si substrate has been observed by a tensile pull test. The metallization bond fails mostly via fracture through either the Si substrate or epoxy adhesive. The intrinsic adhesion pull strength of the metallization scheme is concluded to be greater than 10 kpsi, and the adhesion exceeds the Si-Si cohesive strength. The Nb-Si and Nb-O bonds at the interface are thermodynamically stable.

引用

页码：2870 / 2874

页数：5

共 9 条

[1]

[Anonymous], 1990, BINARY ALLOY PHASE D

[2]

BACON DD, 1993, Patent No. 51234153

[3] SIMPLE NB METAL-BONDING STRUCTURE [J].

CHEN, HS ;

BACON, DD ;

CHEN, CH ;

KAMMLOTT, G ;

JENG, GK ;

WERDER, DJ ;

TAI, KL .

APPLIED PHYSICS LETTERS, 1995, 66 (17) :2191-2193

[4]

Hultgren R., 1973, SELECTED VALUES THER

[5]

MIEDEMA AR, 1975, CRYSTAL STRUCTURE CH

[6]

Samsonov G.V., 1980, HDB REFRACTORY COMPO

[7]

WADA O, 1990, MATER RES SOC SYMP P, V181, P273, DOI 10.1557/PROC-181-273

[8]

WERDER DJ, UNPUB

[9]

1984, HDB CHEM PHYSICS

← 1 →