FRACTURE-MECHANICS OF A NEW BLISTER TEST WITH STABLE CRACK-GROWTH

被引：83

作者：

WAN, KT ^{[1
]}

MAI, YW ^{[1
]}

机构：

[1] UNIV SYDNEY, DEPT MECH & MECHATRON ENGN, CTR ADV MAT TECHNOL, SYDNEY, NSW 2006, AUSTRALIA

来源：

ACTA METALLURGICA ET MATERIALIA | 1995年 / 43卷 / 11期

基金：

澳大利亚研究理事会;

关键词：

D O I：

10.1016/0956-7151(95)00108-8

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

A new blister test is proposed to measure the specific work of adhesion W between a thin flexible film on a rigid substrate. In contrast to the conventional blister loaded by constant fluid pressure which leads to catastrophic crack propagation, the new test is driven by an internal expansion of a fixed mass of working gas which leads to stable crack growth. The new technique is demonstrated by measuring W of an interface with a commercial sticky tape serving as the thin film and aluminium as the rigid substrate.

引用

页码：4109 / 4115

页数：7

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