FRACTURE-MECHANICS OF A NEW BLISTER TEST WITH STABLE CRACK-GROWTH

被引：81
|
作者：
WAN, KT [1 ]
MAI, YW [1 ]
机构：
[1] UNIV SYDNEY, DEPT MECH & MECHATRON ENGN, CTR ADV MAT TECHNOL, SYDNEY, NSW 2006, AUSTRALIA
来源：
ACTA METALLURGICA ET MATERIALIA | 1995年 / 43卷 / 11期
基金：
澳大利亚研究理事会;
关键词：
D O I：
10.1016/0956-7151(95)00108-8
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
A new blister test is proposed to measure the specific work of adhesion W between a thin flexible film on a rigid substrate. In contrast to the conventional blister loaded by constant fluid pressure which leads to catastrophic crack propagation, the new test is driven by an internal expansion of a fixed mass of working gas which leads to stable crack growth. The new technique is demonstrated by measuring W of an interface with a commercial sticky tape serving as the thin film and aluminium as the rigid substrate.
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页码：4109 / 4115
页数：7
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