THE EFFECTS OF PULSE PLATING ON LOW-CONTRACTION CHROMIUM ELECTRODEPOSITS

被引：0

作者：

MILLER, M

PAN, SK

机构：

来源：

PLATING AND SURFACE FINISHING | 1992年 / 79卷 / 07期

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D O I：

暂无

中图分类号：

TF [冶金工业];

学科分类号：

0806 ;

摘要：

Pulse plating of low-contraction (LC) chromium using low pulse frequencies (less than 50 Hz) and high pulse frequencies (greater than 90 Hz) was evaluated and compared to direct-current-plated LC chromium, with respect to microstructure and mechanical properties. Low-frequency pulse plating significantly increases the hardness and cathode current efficiency (CCE) over dc-plated LC electrodeposits, but results in lower tensile strengths. High-frequency pulse plating produces poor quality deposits with lower hardness, CCE, and ultimate tensile strengths (UTS) than those obtained by d-c plating.

引用

页码：49 / 56

页数：8