BEHAVIOR OF ELECTRODEPOSITION AND CHARACTERISTIC OF ZINC-MANGANESE ALLOY

被引：0
|
作者：
URAKAWA, T [1 ]
SAGIYAMA, M [1 ]
ADANIYA, T [1 ]
HARA, T [1 ]
机构：
[1] NIPPON KOKAN KK,TECH RES CTR,KAWASAKI KU,KAWASAKI 210,JAPAN
来源：
TRANSACTIONS OF THE IRON AND STEEL INSTITUTE OF JAPAN | 1983年 / 23卷 / 08期
关键词：
D O I：
暂无
中图分类号：
TF [冶金工业];
学科分类号：
0806 ;
摘要：
引用
收藏
页码：B292 / B292
页数：1
相关论文
共 50 条
  • [1] Zinc-manganese alloy electrodeposition
    Gabe, D.R.
    Wilcox, G.D.
    Jamani, A.
    Pearson, B.R.
    Metal Finishing, 1993, 91 (08) : 34 - 36
  • [2] Electrodeposition of zinc-manganese alloy
    Wielage, B.
    Steinhaeuser, S.
    Nickelmann, D.
    Galvanotechnik, 1998, 89 (03): : 724 - 730
  • [3] Influence of selenates on the electrodeposition of zinc-manganese alloy
    Griskonis, E
    Sulcius, A
    BULLETIN OF ELECTROCHEMISTRY, 2005, 21 (12): : 561 - 570
  • [4] Pulsed electrodeposition of zinc-manganese alloys
    2001, Maik Nauka (37):
  • [5] Pulsed electrodeposition of zinc-manganese alloys
    Danilov, FI
    Gerasimov, VV
    Sukhomlin, DA
    RUSSIAN JOURNAL OF ELECTROCHEMISTRY, 2001, 37 (03) : 308 - 310
  • [6] ELECTRODEPOSITION OF ZINC-MANGANESE ON STEEL STRIP
    SAGIYAMA, M
    URAKAWA, T
    ADANIYA, T
    HARA, T
    FUKUDA, Y
    PLATING AND SURFACE FINISHING, 1987, 74 (11): : 77 - 82
  • [7] The influence of glycerol as an additive in Zinc-Manganese alloy coatings formed by electrodeposition
    de Araujo, Eliene Leandro
    Rodrigues, Alisson Mendes
    Viana, Anderson Bezerra
    Viana, Rommel Bezerra
    ACTA SCIENTIARUM-TECHNOLOGY, 2019, 41
  • [8] Electrodeposition of zinc-manganese alloy coatings from ionic liquid electrolytes
    Chung, P. P.
    Cantwell, P. A.
    Wilcox, G. D.
    Critchlow, G. W.
    TRANSACTIONS OF THE INSTITUTE OF METAL FINISHING, 2008, 86 (04): : 211 - 219
  • [9] ZINC-MANGANESE ALLOY ELECTROPLATING ON STEEL STRIP
    SAGIYAMA, M
    URAKAWA, T
    ADANIYA, T
    HARA, T
    FUKUDA, Y
    PLATING AND SURFACE FINISHING, 1987, 74 (02): : 40 - 40
  • [10] Zinc-manganese alloy plating - A critical review
    John, S
    Silaimani, SM
    Anand, V
    Vasudevan, T
    BULLETIN OF ELECTROCHEMISTRY, 2002, 18 (09): : 407 - 412
12345