THERMAL AND PHYSICAL-PROPERTIES AND ETCHING CHARACTERISTICS OF PI FILMS

被引：18

作者：

ENDO, A

YADA, T

机构：

来源：

JOURNAL OF THE ELECTROCHEMICAL SOCIETY | 1985年 / 132卷 / 01期

关键词：

D O I：

10.1149/1.2113752

中图分类号：

O646 [电化学、电解、磁化学];

学科分类号：

081704 ;

摘要：

引用

页码：155 / 158

页数：4

共 9 条

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[2] NOVEL BEAM LEAD GAAS SCHOTTKY-BARRIER DIODE FABRICATED BY USING THICK POLYIMIDE FILM [J].

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IEEE TRANSACTIONS ON ELECTRON DEVICES, 1979, 26 (11) :1799-1804

[3] MOLECULAR AGGREGATION OF SOLID AROMATIC POLYMERS .1. SMALL-ANGLE X-RAY-SCATTERING FROM AROMATIC POLYIMIDE FILM [J].

ISODA, S ;

SHIMADA, H ;

KOCHI, M ;

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[4]

KAMBE H, 1972, ZAIRYO, V21, P405

[5]

KAZARYAN LG, 1972, VYSOKOMOL SOEDIN A, V14, P1199

[6]

KOCHI M, 1980, POLYM PREPR JPN, V29, P2095

[7]

NEVON JH, 1981, MICROELECTRON RELIAB, V21, P669

[8] NOVEL PLANAR MULTILEVEL INTERCONNECTION TECHNOLOGY UTILIZING POLYIMIDE [J].

SATO, K ;

HARADA, S ;

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[9]

WADA Y, 1976, BUSSEI KOGAKU KOZA, P144

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