TRANSMISSION ELECTRON-MICROSCOPY OF GOLD-SILICON INTERACTIONS ON THE BACKSIDE OF SILICON-WAFERS

被引:40
作者
CHANG, PH [1 ]
BERMAN, G [1 ]
SHEN, CC [1 ]
机构
[1] TEXAS INSTRUMENTS INC,MIL PROD,DALLAS,TX 75265
关键词
D O I
10.1063/1.339928
中图分类号
O59 [应用物理学];
学科分类号
摘要
引用
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页码:1473 / 1477
页数:5
相关论文
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