THERMAL-CONDUCTIVITY AND CONTACT CONDUCTANCE OF BSCCO-2212 MATERIAL

被引:9
作者
YANG, ST
CHEN, BJ
HELLSTROM, EE
STIERS, E
PFOTENHAUER, JM
机构
[1] Applied Superconductivity Center, University of Wisconsin - Madison, Madison
关键词
D O I
10.1109/77.402844
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Thermal conductivity of bulk high temperature superconducting materials is a very important property in the current lead applications because it determines the heat load of the lead at the low temperature end. The thermal conductivity of BSCCO-2212 superconducting material has been measured between 10 and 130 K. Our results compare favorably with other published results, The thermal contact conductance between a joint of BSCCO-2212 and copper has also been measured. Our results indicate that although this kind of joint provides a relatively poor thermal interface, the electrical resistance is small. This feint is still a good choice for making a easy Joint which requires both thermal and electrical interfacing.
引用
收藏
页码:1471 / 1474
页数:4
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