NUMERICAL SIMULATION OF HIGH-DENSITY APPROACH TO LASER FUSION

被引:0
作者
ZIMMERMAN, GB [1 ]
机构
[1] UNIV CALIF, LAWRENCE LIVERMORE LAB, LIVERMORE, CA 94550 USA
来源
TRANSACTIONS OF THE AMERICAN NUCLEAR SOCIETY | 1973年 / 17卷 / NOV期
关键词
D O I
暂无
中图分类号
TL [原子能技术]; O571 [原子核物理学];
学科分类号
0827 ; 082701 ;
摘要
引用
收藏
页码:226 / 227
页数:2
相关论文
共 50 条
[21]   Discrete particle simulation for high-density crowd [J].
Kawaguchi, Toshihiro .
CONFERENCE ON PEDESTRIAN AND EVACUATION DYNAMICS 2014 (PED 2014), 2014, 2 :418-423
[22]   Quantum simulation of high-density amorphous ice [J].
Gai, HD ;
Schenter, GK ;
Garrett, BC .
PHYSICAL REVIEW B, 1996, 54 (21) :14873-14876
[23]   LASER ABLATION OF POLYMERS FOR HIGH-DENSITY INTERCONNECT [J].
LIU, YS ;
COLE, HS ;
GUIDA, R .
MICROELECTRONIC ENGINEERING, 1993, 20 (1-2) :15-29
[24]   Quantum simulation of high-density amorphous ice [J].
Gai, H. ;
Schenter, G. K. ;
Garrett, B. C. .
Physical Review B: Condensed Matter, 54 (21)
[25]   SIMULATION STUDIES OF HIGH-DENSITY METALLIC HYDROGEN [J].
MON, KK ;
ASHCROFT, NW .
BULLETIN OF THE AMERICAN PHYSICAL SOCIETY, 1980, 25 (03) :436-436
[26]   HIGH-DENSITY INTERCONNECTS USING LASER LITHOGRAPHY [J].
LEVINSON, LM ;
EICHELBERGER, CW ;
WOJNAROWSKI, RJ ;
CARLSON, RO .
PROCEEDING OF THE TECHNICAL PROGRAM OF NEPCON WEST 89, VOLS 1 AND 2, 1989, :1319-1327
[27]   Relativistic laser channeling into high-density plasmas [J].
Lei, A. L. ;
Tanaka, K. A. ;
Pukhov, A. ;
Kodama, R. ;
Yabuuchi, T. ;
Adumi, K. ;
Freeman, R. R. ;
Izawa, Y. ;
Kitagawa, Y. ;
Kondo, K. ;
Kumar, G. R. ;
Matsuoka, T. ;
Mima, K. ;
Norimatsu, T. ;
Shorokhov, O. ;
Snavely, R. ;
Zheng, J. .
JOURNAL DE PHYSIQUE IV, 2006, 133 :409-412
[28]   HIGH-DENSITY LINEAR-SYSTEMS FOR FUSION POWER [J].
ELLIS, WR ;
KRAKOWSKI, RA .
BULLETIN OF THE AMERICAN PHYSICAL SOCIETY, 1975, 20 (12) :1532-1532
[29]   POSSIBILITY OF MONOTROPIC FUSION IN CRYSTALS WITH HIGH-DENSITY OF DEFECTS [J].
IVLEV, VI .
ZHURNAL FIZICHESKOI KHIMII, 1983, 57 (02) :455-457
[30]   HIGH-DENSITY LASER LINKING OF METAL INTERCONNECT [J].
BERNSTEIN, JB ;
VENTURA, TM ;
RADOMSKI, AT .
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART A, 1994, 17 (04) :590-593