LAYERED AND HOMOGENEOUS FILMS OF ALUMINUM AND ALUMINUM SILICON WITH TITANIUM AND TUNGSTEN FOR MULTILEVEL INTERCONNECTS

被引：39

作者：

GARDNER, DS ^{[1
]}

MICHALKA, TL ^{[1
]}

SARASWAT, KC ^{[1
]}

BARBEE, TW ^{[1
]}

MCVITTIE, JP ^{[1
]}

MEINDL, JD ^{[1
]}

机构：

[1] STANFORD UNIV,DEPT MAT SCI & ENGN,STANFORD,CA 94305

来源：

IEEE TRANSACTIONS ON ELECTRON DEVICES | 1985年 / 32卷 / 02期

关键词：

D O I：

10.1109/T-ED.1985.21927

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

引用

页码：174 / 183

页数：10

共 39 条

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Rey A., 1984, 1984 Proceedings of the First International IEEE VLSI Multilevel Interconnection Conference (Cat. No. 84CH1992-2), P139

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ROSENBERG R, 1978, THIN FILMS INTERDIFF, P48

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