Carbon Nanotubes in Nanopackaging Applications

被引:16
作者
Maffucci, Antonio [1 ]
机构
[1] Univ Cassino, Fac Engn, Elect Engn, Cassino, Italy
关键词
D O I
10.1109/MNANO.2009.934214
中图分类号
TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
[No abstract available]
引用
收藏
页码:22 / 25
页数:4
相关论文
共 21 条
[1]   Thermomechanical Reliability of Nickel Pillar Interconnections Replacing Flip-Chip Solder Without Underfill [J].
Aggarwal, Ankur O. ;
Raj, P. Markondeya ;
Lee, Baik-Woo ;
Yim, Myung Jin ;
Iyer, Mahadevan ;
Wong, C. P. ;
Tummala, Rao R. .
IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING, 2008, 31 (04) :341-354
[2]  
BANERJEE K, 2008, P IEEE NAN C ARL TX, P432
[3]   Luttinger liquid theory as a model of the gigahertz electrical properties of carbon nanotubes [J].
Burke, PJ .
IEEE TRANSACTIONS ON NANOTECHNOLOGY, 2002, 1 (03) :129-144
[4]   A 1 GHz integrated circuit with carbon nanotube interconnects and silicon transistors [J].
Close, Gael F. ;
Yasuda, Shinichi ;
Paul, Bipul ;
Fujita, Shinobu ;
Wong, H. -S. Philip .
NANO LETTERS, 2008, 8 (02) :706-709
[5]  
Forestiere C., 2009, P IEEE NAN C GEN IT
[6]   Thermal properties of carbon nanotubes and nanotube-based materials [J].
Hone, J ;
Llaguno, MC ;
Biercuk, MJ ;
Johnson, AT ;
Batlogg, B ;
Benes, Z ;
Fischer, JE .
APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING, 2002, 74 (03) :339-343
[7]  
ITRS, 2007, INT TECHNOLOGY ROADM
[8]   Multichannel ballistic transport in multiwall carbon nanotubes [J].
Li, HJ ;
Lu, WG ;
Li, JJ ;
Bai, XD ;
Gu, CZ .
PHYSICAL REVIEW LETTERS, 2005, 95 (08)
[9]  
Liu J., 2008, P ECPTHDP 2008 SHANG
[10]   Fabrication and Electrical Characterization of Densified Carbon Nanotube Micropillars for IC Interconnection [J].
Liu, Zhengchun ;
Ci, Lijie ;
Kar, Swastik ;
Ajayan, Pulickel M. ;
Lu, Jian-Qiang .
IEEE TRANSACTIONS ON NANOTECHNOLOGY, 2009, 8 (02) :196-203