INTERMETALLIC COMPOUND GROWTH AND SOLDERABILITY OF REFLOWED TIN AND TIN-LEAD COATINGS

被引：0

作者：

DAVIS, PE ^{[1
]}

WARWICK, ME ^{[1
]}

MUCKETT, SJ ^{[1
]}

机构：

[1] INT TIN RES INST,DIV MET & TINPLATE,GREENFORD UB6 7AQ,MIDDX,ENGLAND

来源：

PLATING AND SURFACE FINISHING | 1983年 / 70卷 / 08期

关键词：

D O I：

暂无

中图分类号：

TF [冶金工业];

学科分类号：

0806 ;

摘要：

引用

页码：49 / 53

页数：5

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