A STUDY OF THE CHEMICAL AND PHYSICAL INTERACTION BETWEEN COPPER AND POLYIMIDE

被引：38

作者：

SHIH, DY

PARASZCZAK, J

KLYMKO, N

FLITSCH, R

NUNES, S

LEWIS, J

YANG, C

CATALDO, J

MCGOUEY, R

GRAHAM, W

SERINO, R

GALLIGAN, E

机构：

来源：

JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS | 1989年 / 7卷 / 03期

关键词：

D O I：

10.1116/1.576293

中图分类号：

TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

引用

页码：1402 / 1412

页数：11

共 26 条

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