ELECTRON AND CHEMICAL-KINETICS IN THE LOW-PRESSURE RF DISCHARGE ETCHING OF SILICON IN SF6

被引:84
|
作者
KLINE, LE
机构
关键词
D O I
10.1109/TPS.1986.4316517
中图分类号
O35 [流体力学]; O53 [等离子体物理学];
学科分类号
070204 ; 080103 ; 080704 ;
摘要
引用
收藏
页码:145 / 155
页数:11
相关论文
共 50 条
  • [31] Electrostatic probe measurement of low-pressure electronegative SF6 discharges
    Joh, H. M.
    Chung, T. H.
    Chung, K. -S.
    THIN SOLID FILMS, 2010, 518 (22) : 6686 - 6689
  • [32] THE ETCHING OF SILICON IN DILUTED SF6 PLASMAS - CORRELATION BETWEEN THE FLUX OF INCIDENT SPECIES AND THE ETCHING KINETICS
    MAHI, B
    ARNAL, Y
    POMOT, C
    JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, 1987, 5 (03): : 657 - 666
  • [33] ION-ASSISTED ETCHING OF SILICON BY SF6
    OOSTRA, DJ
    HARING, A
    DEVRIES, AE
    SANDERS, FHM
    MIYAKE, K
    APPLIED PHYSICS LETTERS, 1985, 46 (12) : 1166 - 1168
  • [34] PHOTOLYTIC ETCHING OF POLYCRYSTALLINE SILICON IN SF6 ATMOSPHERE
    WATANABE, S
    UEDA, S
    NAKAZATO, N
    TAKAI, M
    JAPANESE JOURNAL OF APPLIED PHYSICS PART 2-LETTERS, 1986, 25 (11): : L881 - L884
  • [35] CRYOGENIC REACTIVE ION ETCHING OF SILICON IN SF6
    BESTWICK, TD
    OEHRLEIN, GS
    ANGELL, D
    APPLIED PHYSICS LETTERS, 1990, 57 (05) : 431 - 433
  • [36] Capacitively Coupled SF6, SF6/O-2, SF6/CH4 Plasma Etching of Acrylic at Low Vacuum Pressure
    Park, Yeon-Hyun
    Joo, Young-Woo
    Kim, Jaek-Won
    Noh, Ho-Seob
    Lee, Je-Won
    KOREAN JOURNAL OF MATERIALS RESEARCH, 2009, 19 (02): : 68 - 72
  • [37] Characterization of low pressure plasma-dc glow discharges (Ar, SF6 and SF6/He) for Si etching
    Chiad, Bahaa T.
    Al-zubaydi, Thair L.
    Khalaf, Mohammad K.
    Khudiar, Ausama I.
    INDIAN JOURNAL OF PURE & APPLIED PHYSICS, 2010, 48 (10) : 723 - 730
  • [38] PULSE-PROBE MEASUREMENTS ON LOW-PRESSURE, LOW-TEMPERATURE SF6
    LYMAN, JL
    RADZIEMSKI, LJ
    NILSSON, AC
    ABSTRACTS OF PAPERS OF THE AMERICAN CHEMICAL SOCIETY, 1979, (APR): : 194 - 194
  • [39] XPS study of the SF6 reactive ion beam etching of silicon at low temperatures
    Tessier, P.Y.
    Chevolleau, T.
    Cardinaud, C.
    Grolleau, B.
    Nuclear Instruments and Methods in Physics Research, Section B: Beam Interactions with Materials and Atoms, 1999, 155 (03): : 280 - 288
  • [40] An XPS study of the SF6 reactive ion beam etching of silicon at low temperatures
    Tessier, PY
    Chevolleau, T
    Cardinaud, C
    Grolleau, B
    NUCLEAR INSTRUMENTS & METHODS IN PHYSICS RESEARCH SECTION B-BEAM INTERACTIONS WITH MATERIALS AND ATOMS, 1999, 155 (03): : 280 - 288