STRUCTURAL RELIABILITY OF CERAMIC MATERIALS

被引:26
|
作者
WIEDERHORN, SM
FULLER, ER
机构
来源
MATERIALS SCIENCE AND ENGINEERING | 1985年 / 71卷 / 1-2期
关键词
D O I
10.1016/0025-5416(85)90228-9
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
引用
收藏
页码:169 / 186
页数:18
相关论文
共 50 条
  • [1] Advanced ceramic structural materials
    V. V. Vikulin
    I. Yu. Kelina
    A. S. Shatalin
    L. N. Rusanova
    Refractories and Industrial Ceramics, 2004, 45 : 383 - 386
  • [2] Advanced ceramic structural materials
    Vikulin, VV
    Kelina, IY
    Shatalin, AS
    Rusanova, LN
    REFRACTORIES AND INDUSTRIAL CERAMICS, 2004, 45 (06) : 383 - 386
  • [3] STRUCTURAL DESIGNING WITH CERAMIC MATERIALS
    DUCKWORTH, W
    BANSAL, G
    JOURNAL OF ENGINEERING FOR POWER-TRANSACTIONS OF THE ASME, 1978, 100 (02): : 260 - 266
  • [4] Materials ageing and structural reliability
    Harlow, DG
    Wei, RP
    INTERNATIONAL JOURNAL OF MATERIALS & PRODUCT TECHNOLOGY, 2001, 16 (4-5): : 304 - 316
  • [5] Materials aging and structural reliability
    Harlow, G
    Wei, RP
    6TH ISSAT INTERNATIONAL CONFERENCE ON RELIABILITY AND QUALITY IN DESIGN, PROCEEDINGS, 2000, : 1 - 6
  • [6] Solving structural problems of ceramic materials
    Golobic, A
    Skapin, SD
    Suvorov, D
    Meden, A
    CROATICA CHEMICA ACTA, 2004, 77 (03) : 435 - 446
  • [7] STRUCTURAL MODIFICATIONS OF IRRADIATED CERAMIC MATERIALS
    LABBE, JC
    ROULT, G
    ANNALES DE CHIMIE-SCIENCE DES MATERIAUX, 1985, 10 (05): : 477 - 479
  • [8] BOUNDARY FILM FOR STRUCTURAL CERAMIC MATERIALS
    AJAYI, OO
    ERDEMIR, A
    HSIEH, JH
    ERCK, RA
    FENSKE, GR
    NICHOLS, FA
    WEAR, 1993, 162 (pt B) : 1150 - 1155
  • [9] Fatigue reliability of dental ceramic materials - an in vitro study
    Stijacic, Tijana
    Hu, Wenjie
    Chung, Kwok-Hung
    Zheng, Cheng
    Flinn, Brian D.
    Raigrodski, Ariel J.
    ADVANCES IN APPLIED CERAMICS, 2019, 118 (1-2) : 56 - 61
  • [10] Research on the structural reliability of the ceramic package for packaging SIP
    Yang, Zhen-tao
    Peng, Bo
    Gao, Ling
    2017 18TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2017, : 524 - 528