LOW-NOISE DC SUPERCONDUCTING QUANTUM INTERFERENCE DEVICES IN BI2SR2CACU2O8+X THIN-FILMS

被引：1

作者：

AMREIN, T

SCHULTZ, L

URBAN, K

机构：

[1] SIEMENS AG, RES LABS, D-91050 ERLANGEN, GERMANY

[2] IFW DRESDEN, INST MET WERKSTOFFE, D-01069 DRESDEN, GERMANY

[3] FORSCHUNGSZENTRUM JULICH, FORSCHUNGSZENTRUM, IFF, IMF, D-52425 JULICH, GERMANY

来源：

JOURNAL OF APPLIED PHYSICS | 1995年 / 77卷 / 12期

关键词：

D O I：

10.1063/1.359084

中图分类号：

O59 [应用物理学];

学科分类号：

摘要：

Low-noise dc superconducting quantum interference devices (SQUIDs) were fabricated by thin film deposition of Bi2Sr2Ca Cu 2O8+x (BSCCO) on bicrystalline substrates of SrTiO 3 with misorientation angles Θ from 24°to 45°. An optimized dc SQUID design (βL=1) was developed for Θ=24°. Therein the SQUID inductance was varied between 7 and 80 pH. Fabricated dc SQUIDs operated at 77 K as well as high-quality YBa 2Cu3O7-y (YBCO) SQUIDs, especially the 1/f and white noise levels were in the lowest range of data reported so far for YBCO SQUIDs and are two orders of magnitude better than noise data published this far for BSCCO SQUIDs at 77 K. © 1995 American Institute of Physics.

引用

页码：6703 / 6709

页数：7

共 20 条

[1]

Dimos D., Chaudhari P., Mannhart J., Phys. Rev. B, 41, (1990)

[2]

Dimos D., Chaudhari P., Mannhart J., LeGoues F.K., Phys. Rev. Lett., 61, (1988)

[3]

Amrein T., Schultz L., Kabius B., Urban K., Phys. Rev. B, 51, (1995)

[4]

Amrein T., Seitz M., Uhl D., Schultz L., Urban K., Appl. Phys. Lett., 63, (1993)

[5]

Friedl G., Daalmans G., Vildic M., Uhl D., Bommel F., Roas B., Hillenbrand B., Stritzker B., Hoenig H.E., IEEE Trans. Appl. Supercond, 3, (1993)

[6]

Nilsson P.A., Ivanov Z.G., Olsson H.K., Winkler D., Claeson T., Stepantsov E.A., Tzalenchuk A.Y., J. Appl. Phys., 75, (1994)

[7]

Please note, that e-beam or thermally evaporated gold layers produced high-ohmic contacts which were useless for noise measurements, The low-ohmic contacts of laser ablated gold layers may be caused by the high kinetic energy of the evaporated particles during the laser ablation process

[8]

Ref. 3

[9]

Clarke J., Koch R.H., Science, 242, (1988)

[10]

Friedl G., Seitz M., Holzapfel B., Roas B., Stritzker B., Daalmans G., Uhl D., Hillenbrand B., Schultz L., Hoenig H.E., Physica C, 209, (1993)

← 1 2 →