共 16 条
- [1] Simultaneous double side grinding of silicon wafers: a literature review INTERNATIONAL JOURNAL OF MACHINE TOOLS & MANUFACTURE, 2006, 46 (12-13): : 1449 - 1458
- [2] An Overview of Current Research on Simultaneous Double Side Grinding of Silicon Wafers CHINA SEMICONDUCTOR TECHNOLOGY INTERNATIONAL CONFERENCE 2010 (CSTIC 2010), 2010, 27 (01): : 1087 - 1092
- [3] Simultaneous Double Side Grinding of Silicon Wafers: A Further Investigation into Grinding Marks Pattern CHINA SEMICONDUCTOR TECHNOLOGY INTERNATIONAL CONFERENCE 2010 (CSTIC 2010), 2010, 27 (01): : 395 - 400
- [4] MIRROR POLISHING OF SILICON-WAFERS .3. DEVELOPMENT OF BOWL FEED AND DOUBLE SIDE POLISHING MACHINE WITH IN-SITU THICKNESS MONITORING OF SILICON-WAFERS INTERNATIONAL JOURNAL OF THE JAPAN SOCIETY FOR PRECISION ENGINEERING, 1994, 28 (01): : 11 - 16
- [10] FOURIER-TRANSFORM INFRARED (FTIR) DETERMINATION OF INTERSTITIAL OXYGEN CONCENTRATION OF SINGLE-SIDE-POLISHED SILICON-WAFERS 7TH INTERNATIONAL CONFERENCE ON FOURIER TRANSFORM SPECTROSCOPY, 1989, 1145 : 332 - 334