THE MICROSTRUCTURE OF SPUTTER-DEPOSITED COATINGS

被引：1128

作者：

THORNTON, JA ^{[1
]}

机构：

[1] UNIV ILLINOIS,COORDINATED SCI LAB,URBANA,IL 61801

来源：

JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS | 1986年 / 4卷 / 06期

关键词：

D O I：

10.1116/1.573628

中图分类号：

TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

引用

页码：3059 / 3065

页数：7

共 74 条

[1] PLANARIZATION BY RADIO-FREQUENCY BIAS SPUTTERING OF ALUMINUM AS STUDIED EXPERIMENTALLY AND BY COMPUTER-SIMULATION [J].

BADER, HP ;

LARDON, MA .

JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS, 1985, 3 (06) :2167-2171

[2] CAUSALITY BOUND ON THE DENSITY OF AGGREGATES [J].

BALL, RC ;

WITTEN, TA .

PHYSICAL REVIEW A, 1984, 29 (05) :2966-2967

[3] EFFECT OF ION-BOMBARDMENT DURING DEPOSITION ON THICK METAL AND CERAMIC DEPOSITS [J].

BLAND, RD ;

KOMINIAK, GJ ;

MATTOX, DM .

JOURNAL OF VACUUM SCIENCE & TECHNOLOGY, 1974, 11 (04) :671-674

[4]

BROPHY JH, 1964, STRUCTURE PROPERTIES, V2, P82

[5] EFFECTS OF ARGON PRESSURE AND SUBSTRATE-TEMPERATURE ON THE STRUCTURE AND PROPERTIES OF SPUTTERED COPPER-FILMS [J].

CRAIG, S ;

HARDING, GL .

JOURNAL OF VACUUM SCIENCE & TECHNOLOGY, 1981, 19 (02) :205-215

[6] COLUMNAR GRAINS AND TWINS IN HIGH-PURITY SPUTTER-DEPOSITED COPPER [J].

DAHLGREN, SD .

JOURNAL OF VACUUM SCIENCE & TECHNOLOGY, 1974, 11 (04) :832-836

[7]

DAHLGREN SD, 1977, THIN SOLID FILMS, V40, P435

[8] COLUMNAR MICROSTRUCTURE IN VAPOR-DEPOSITED THIN-FILMS [J].

DIRKS, AG ;

LEAMY, HJ .

THIN SOLID FILMS, 1977, 47 (03) :219-233

[9] MICROPOROSITY IN 304 STAINLESS-STEEL FILMS PREPARED BY VAPOR QUENCHING [J].

FABIS, PM .

THIN SOLID FILMS, 1985, 128 (1-2) :57-66

[10] HYDROGEN CONTENT AND DENSITY OF PLASMA-DEPOSITED AMORPHOUS SILICON-HYDROGEN [J].

FRITZSCHE, H ;

TANIELIAN, M ;

TSAI, CC ;

GACZI, PJ .

JOURNAL OF APPLIED PHYSICS, 1979, 50 (05) :3366-3369

← 1 2 3 4 5 6 7 8 →