CAD-BASED NET CAPACITANCE TESTING OF UNPOPULATED MCM SUBSTRATES

被引：7

作者：

MARSHALL, J

CHONG, FC

MODLIN, D

WESTBROOK, S

机构：

[1] MICROMODULE SYST,CUPERTINO,CA

[2] MOLEC DEVICES,MENLO PK,CA

来源：

IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART B-ADVANCED PACKAGING | 1994年 / 17卷 / 01期

关键词：

MULTIPLE-CHIP MODULE; TESTING; CAPACITANCE; CAD;

D O I：

10.1109/96.296430

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

This paper presents an approach to CAD-based generation of expected test values for capacitive net verification in unpopulated multiple-chip modules (MCMs). The superposition model underlying the capacitance estimation technique is discussed along with implementation details and test results from CAD-based testing of DEC VAX-9000 MCMs.

引用

页码：50 / 55

页数：6