THIN-FILM DEPOSITION TECHNIQUES AND DESIGN OF THIN-FILM PASSIVE COMPONENTS

被引：0

|

作者：

SINGH, A ^{[1
]}

机构：

[1] CENT ELECTR ENGN RES INST,DIV SOLID STATE DEVICES,PILANI,RAJASTHAN,INDIA

来源：

MICROELECTRONICS AND RELIABILITY | 1976年 / 15卷 / 03期

关键词：

D O I：

10.1016/0026-2714(76)90757-5

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

引用

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页码：233 / 238

页数：6

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