ADHESION OF COPPER-FILMS TO ALUMINUM-OXIDE USING A SPINEL STRUCTURE INTERFACE

被引：34

作者：

KATZ, G ^{[1
]}

机构：

[1] IBM CORP,THOMAS J WATSON RES CTR,YORKTOWN HTS,NY 10598

来源：

THIN SOLID FILMS | 1976年 / 33卷 / 01期

关键词：

D O I：

10.1016/0040-6090(76)90591-5

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

引用

页码：99 / 105

页数：7

共 16 条

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[3] MEASUREMENT OF ADHESION OF THIN FILMS [J].

BENJAMIN, P ;

WEAVER, C .

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[4] EFFECT OF ION BOMBARDMENT ON ADHESION OF ALUMINIUM FILMS ON GLASS [J].

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STROUD, PT .

THIN SOLID FILMS, 1969, 4 (01) :41-&

[5]

GADALLA AMM, 1964, BRIT CERAM T, V63, P39

[6] SOME FACTORS INFLUENCING THE ADHESION OF FILMS PRODUCED BY VACUUM EVAPORATION [J].

HEAVENS, OS .

JOURNAL DE PHYSIQUE ET LE RADIUM, 1950, 11 (07) :355-360

[7] ELECTRON DIFFRACTION STUDIES ON OXIDE FILMS FORMED ON METALS AND ALLOYS .1. OXIDATION OF PURE COPPER [J].

HONJO, G .

JOURNAL OF THE PHYSICAL SOCIETY OF JAPAN, 1949, 4 (4-6) :330-333

[8] SCRATCH TEST FOR MEASURING ADHERENCE OF THIN FILMS TO OXIDE SUBSTRATES [J].

KARNOWSKY, MM ;

ESTILL, WB .

REVIEW OF SCIENTIFIC INSTRUMENTS, 1964, 35 (10) :1324-&

[9] EPITAXY OF COPPER ON SAPPHIRE [J].

KATZ, G .

APPLIED PHYSICS LETTERS, 1968, 12 (05) :161-&

[10]

MCDONALD JE, 1965, T METALL SOC AIME, V233, P512

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