CHARACTERISTIC IMPEDANCE OF INTEGRATED-CIRCUIT BOND WIRES

被引：25
作者：
CAVERLY, RH
机构：
来源：
IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES | 1986年 / 34卷 / 09期
关键词：
D O I：
10.1109/TMTT.1986.1133480
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
引用
收藏
页码：982 / 984
页数：3
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