PREPARATION OF NEGATIVE PHOTOREACTIVE POLYIMIDE AND ITS CHARACTERIZATION

In this article, a polyimide precursor was synthesized from oxydianiline and a diacid chloride. This diacid chloride was prepared by the reaction of thionyl chloride with a diacid, which resulted from the reaction of pyromellitic dianhydride with cinnamyl alcohol in N-methyl-pyrrolidone (NMP). The photoresist, made from the above polyimide precursor, was spincoated onto silicon wafers, prebaked, and then exposed to UV light with a high pressure Hg lamp. The pattern generation process was also investigated. The appropriate conditions of the photolithographic procedures, involving photoresist compounding, spin coating, pre-baking, exposure, development, rinse, postbaking, etc., were determined. The experimental results show that the photoresist exhibited excellent thermal stability and adequate photosensitivity.