ANALYSIS OF MULTILAYER MICROSTRIP LINES BY A CONFORMAL MAPPING METHOD

被引：104

作者：

SVACINA, J

机构：

[1] Department of Radioelectronics, Faculty of Electrical Engineering Technical University of Brno, 662 09, Brno, Antoninska I

来源：

IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES | 1992年 / 40卷 / 04期

关键词：

D O I：

10.1109/22.127530

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

The article contains an investigation of multilayer microstrip transmission lines. The conformal mapping method is used to obtain simple analytical relations for the filling factors and the effective permittivity of two fundamental types of three-layer microstrips. Numerical results obtained by the present method are compared with available data from other authors.

引用

页码：769 / 772

页数：4

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