TRANSVERSE MAGNETORESISTANCE OF OXYGEN-FREE COPPER

被引:6
|
作者
FICKETT, FR
机构
关键词
D O I
10.1109/20.11437
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
引用
收藏
页码:1156 / 1158
页数:3
相关论文
共 50 条
  • [31] Mechanism of intergranular penetration of liquid filler metal into oxygen-free copper
    Guoqian Mu
    Yanhua Zhang
    Wenqing Qu
    Hongshou Zhuang
    Welding in the World, 2022, 66 : 1447 - 1460
  • [32] Sustainable Oxygen-Free Copper Powder Production Method from Wastes
    Emami, Salar
    Aghajani, Hossein
    Tabrizi, Arvin Taghizadeh
    JOURNAL OF SUSTAINABLE METALLURGY, 2023, 9 (04) : 1803 - 1809
  • [33] Study on Orthogonal Micro-cutting Deformation of Oxygen-free Copper
    Yuan, Shuaishuai
    Li, Yiquan
    Xu, Jinkai
    Zhai, Changtai
    2019 IEEE INTERNATIONAL CONFERENCE ON MANIPULATION, MANUFACTURING AND MEASUREMENT ON THE NANOSCALE (IEEE 3M-NANO), 2019, : 11 - 15
  • [34] Characterization of the tribologically relevant cover layers formed on copper in oxygen and oxygen-free conditions
    Selina Raumel
    Khemais Barienti
    Hoang-Thien Luu
    Nina Merkert
    Folke Dencker
    Florian Nürnberger
    Hans Jürgen Maier
    Marc Christopher Wurz
    Friction, 2023, 11 : 1505 - 1521
  • [35] Sustainable Oxygen-Free Copper Powder Production Method from Wastes
    Salar Emami
    Hossein Aghajani
    Arvin Taghizadeh Tabrizi
    Journal of Sustainable Metallurgy, 2023, 9 : 1803 - 1809
  • [36] Performance Analysis of Molybdenum and Oxygen-free Copper Vacuum Brazed Joints
    Wang, Cong
    Wang, Bofeng
    Zhang, Hongqi
    Zhao, Jinyu
    Tian, Ning
    Xie, Jiayu
    Chang, Chongjie
    2024 JOINT INTERNATIONAL VACUUM ELECTRONICS CONFERENCE AND INTERNATIONAL VACUUM ELECTRON SOURCES CONFERENCE, IVEC + IVESC 2024, 2024,
  • [37] EVOLUTION OF HOMOGENEITY IN OXYGEN-FREE COPPER PROCESSED BY EITHER ECAP OR HPT
    Alawadhi, Meshal Y.
    Huang, Yi
    Langdon, Terence G.
    REVIEWS ON ADVANCED MATERIALS SCIENCE, 2017, 50 (1-2) : 47 - 54
  • [39] Study on the Deep-hole Honing of Cavity of Oxygen-free Copper
    Liu, Zhanfeng
    Feng, Yazhou
    MANUFACTURING PROCESS TECHNOLOGY, PTS 1-5, 2011, 189-193 : 3158 - 3161
  • [40] Study on the vacuum properties of laser-etched oxygen-free copper
    Zhang, W. L.
    Ma, W. J.
    Wang, S. H.
    Fan, L.
    Ge, X. Q.
    Bian, B. Y.
    Fang, J. W.
    Wang, Y.
    IPAC23 PROCEEDINGS, 2024, 2687