SF6/N-2 MIXTURES - BASIC AND HV INSULATION PROPERTIES

被引:223
作者
CHRISTOPHOROU, LG
VANBRUNT, RJ
机构
[1] National Institute of Standards and Technology, Gaithersburg, MD
关键词
D O I
10.1109/94.469988
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
The widespread use of SF6 by the electric power and other industries has led to increased concentrations of SF6 in the atmosphere, This causes concern as to possible effects on global warming, because SF6 is a potent greenhouse gas. This paper first touches on this issue and then documents the behavior of high pressure gases such as N-2 and SB6/N-2 mixtures that can be realistically considered as acceptable intermediate or long-term replacements for pure SF6 in some HV applications. The possible use of dilute SF6/N-2 mixtures as an alternative to pure SF6 for some of industry's insulation needs (albeit at higher pressure) is documented, and existing knowledge on these mixtures and on the individual components (N-2 and SF6), both basic and applied, is compiled. A guide to existing literature is provided.
引用
收藏
页码:952 / 1003
页数:52
相关论文
共 356 条
  • [1] [Anonymous], 1973, MOBILITY DIFFUSION I
  • [2] ASCHWANDEN T, 1987, 18TH P INT C PHEN IO, P102
  • [3] ASCHWANDEN T, 1980, 6TH P INT C GAS DISC, V189, P24
  • [4] ASCHWANDEN T, 1979, 3RD INT S HV ENG MIL
  • [5] ASCHWANDEN T, 1985, THESIS THZ ZURICH
  • [6] NEGATIVE ION-MOLECULE REACTIONS OF SF4
    BABCOCK, LM
    STREIT, GE
    [J]. JOURNAL OF CHEMICAL PHYSICS, 1981, 75 (08) : 3864 - 3870
  • [7] BAKER A, 1980, EPRI EL1646 REP
  • [8] Baumgartner R. G., 1974, 3rd International Conference on Gas Discharges, P366
  • [9] INFLUENCE OF DISCHARGE PRODUCTION CONDITIONS, GAS-PRESSURE, CURRENT INTENSITY AND VOLTAGE TYPE, ON SF6 DISSOCIATION UNDER POINT PLANE CORONA DISCHARGES
    BELARBI, A
    PRADAYROL, C
    CASANOVAS, J
    CASANOVAS, AM
    [J]. JOURNAL OF APPLIED PHYSICS, 1995, 77 (04) : 1398 - 1406
  • [10] SF6 DECOMPOSITION UNDER POWER ARCS - CHEMICAL ASPECTS
    BELMADANI, B
    CASANOVAS, J
    CASANOVAS, AM
    [J]. IEEE TRANSACTIONS ON ELECTRICAL INSULATION, 1991, 26 (06): : 1177 - 1189