ORGANOMETALLIC CATALYSTS FOR THE THERMAL AND PHOTOCURE OF CYANATE ESTER RESINS

被引:0
|
作者
MCCORMICK, FB [1 ]
BROWNWENSLEY, KA [1 ]
DEVOE, RJ [1 ]
机构
[1] THREE M CO,RES LABS,ST PAUL,MN 55144
来源
ABSTRACTS OF PAPERS OF THE AMERICAN CHEMICAL SOCIETY | 1992年 / 203卷
关键词
D O I
暂无
中图分类号
O6 [化学];
学科分类号
0703 ;
摘要
引用
收藏
页码:234 / PMSE
相关论文
共 50 条
  • [21] LOW DIELECTRIC FLUOROMETHYLENE CYANATE ESTER RESINS
    SNOW, AW
    BUCKLEY, LJ
    ABSTRACTS OF PAPERS OF THE AMERICAN CHEMICAL SOCIETY, 1995, 209 : 248 - PMSE
  • [22] Specific heat, thermal conductivity, and magnetic susceptibility of cyanate ester resins - An alternative to commonly used epoxy resins
    Nakamura, Sachiko
    Fujii, Takenori
    Matsukawa, Shoji
    Katagiri, Masayuki
    Fukuyama, Hiroshi
    CRYOGENICS, 2018, 95 : 76 - 81
  • [24] Synthesis and characterization of new epoxy and cyanate ester resins
    Lakshmi, MS
    Reddy, BSR
    EUROPEAN POLYMER JOURNAL, 2002, 38 (04) : 795 - 801
  • [25] TECHNOLOGICAL AND COMMERCIAL EVOLUTION OF MULTIFUNCTIONAL CYANATE ESTER RESINS
    DAS, S
    DEANTONIS, F
    ABSTRACTS OF PAPERS OF THE AMERICAN CHEMICAL SOCIETY, 1994, 208 : 340 - PMSE
  • [26] POLYCYANURATE FUNDAMENTALS - ADDITIVES AND MODIFIERS FOR CYANATE ESTER RESINS
    PASCAULT, JP
    ABSTRACTS OF PAPERS OF THE AMERICAN CHEMICAL SOCIETY, 1994, 208 : 303 - PMSE
  • [27] Book review: Chemistry and technology of cyanate ester resins
    Hamerton, I.
    Chemistry and Industry (London), 1995, (21):
  • [28] Synthesis and characterization of new epoxy and cyanate ester resins
    Suguna Lakshmi, M.
    Reddy, B.S.R.
    1600, Elsevier Ltd (38):
  • [29] Effect of diffusional limitations on the gelation of cyanate ester resins
    Deng, Y
    Martin, GC
    JOURNAL OF APPLIED POLYMER SCIENCE, 1997, 64 (01) : 115 - 125
  • [30] Modified cyanate ester resins with lower dielectric loss, improved thermal stability, and flame retardancy
    Zhuo, Dongxian
    Gu, Aijuan
    Liang, Guozheng
    Hu, Jiang-tao
    Zhou, Cheng
    Yuan, Li
    POLYMERS FOR ADVANCED TECHNOLOGIES, 2011, 22 (12) : 2617 - 2625