IMPROVED LSI METALLIZATION USING SI-AL SEQUENTIAL EVAPORATION AND ANODIZATION

被引:0
|
作者
TAKAHATA, K [1 ]
KAUCHI, K [1 ]
KUBOTA, T [1 ]
MUKOHGAWA, M [1 ]
SHIBA, H [1 ]
机构
[1] NIPPON ELECT CO LTD,DIV INTEGRATED CIRCUITS,NAKAHARA KU,KAWASAKI,JAPAN
关键词
D O I
暂无
中图分类号
O646 [电化学、电解、磁化学];
学科分类号
081704 ;
摘要
引用
收藏
页码:C269 / C269
页数:1
相关论文
共 37 条
  • [1] MICROPROBE AUGER ANALYSIS OF SI MIGRATION IN AL METALLIZATION FOR LSI
    INOUE, T
    HORIUCHI, S
    IWAI, H
    SHIMIZU, H
    ISHIDA, T
    JAPANESE JOURNAL OF APPLIED PHYSICS, 1976, 15 : 63 - 69
  • [2] ELECTRON-MICROSCOPY AND MICROANALYSIS OF AL AND AL+SI LSI METALLIZATION
    SAWICKA, D
    VERTESY, A
    TOTH, A
    MIKROSKOPIE, 1983, 40 (3-4) : 112 - 112
  • [3] AL-SI METALLIZATION BY RATE CONTROLLED DUAL EB-GUN EVAPORATION
    HEGNER, F
    FEUERSTEIN, A
    VAKUUM-TECHNIK, 1979, 28 (01): : 3 - 11
  • [4] Kinetic study of vacuum evaporation of elements from ternary melts; case of dilute solution of P in Si-Al melts
    Hoseinpur, Arman
    Tang, Kai
    Safarian, Jafar
    SEPARATION AND PURIFICATION TECHNOLOGY, 2020, 235
  • [5] Optimization of the Surface Structure of the Si Substrate for Si-Al Bonding Using Simulation by the Phase Field Method
    Iwata, Kyohei
    Yuchi, Ryusuke
    Sasajima, Yasushi
    Onuki, Jin
    JOURNAL OF ELECTRONIC MATERIALS, 2021, 50 (08) : 4770 - 4780
  • [6] Optimization of the Surface Structure of the Si Substrate for Si-Al Bonding Using Simulation by the Phase Field Method
    Kyohei Iwata
    Ryusuke Yuchi
    Yasushi Sasajima
    Jin Onuki
    Journal of Electronic Materials, 2021, 50 : 4770 - 4780
  • [7] Study on Oxidization and Mass Transfer of Al from Si-Al Melt Using Top Oxygen Blowing Refining
    Jing Cao
    Ding Yang
    Jijun Wu
    Huazhen Gu
    Xinyue Cai
    Yi Zeng
    Wenhui Ma
    Silicon, 2022, 14 : 9805 - 9812
  • [8] Study on Oxidization and Mass Transfer of Al from Si-Al Melt Using Top Oxygen Blowing Refining
    Cao, Jing
    Yang, Ding
    Wu, Jijun
    Gu, Huazhen
    Cai, Xinyue
    Zeng, Yi
    Ma, Wenhui
    SILICON, 2022, 14 (15) : 9805 - 9812
  • [9] Microstructure of Burned Ultra-Low-Density Fiberboards using Plant Fiber as the Matrix and Si-Al compounds as the Filler
    Niu, Min
    Wang, Xiaodong
    Hagman, Olle
    Karlsson, Olov
    Xie, Yongqun
    BIORESOURCES, 2015, 10 (02): : 2903 - 2912
  • [10] THIN-FILM METALLIZATION STUDIES AND DEVICE LIFETIME PREDICTION USING AL-SI AND AL-CU-SI CONDUCTOR TEST BARS
    DANSO, KA
    TULLOS, L
    MICROELECTRONICS AND RELIABILITY, 1981, 21 (04): : 513 - 527