SHEAR DEFORMATION OF INDIUM SOLDER JOINTS

被引：17

作者：

DARVEAUX, R ^{[1
]}

TURLIK, I ^{[1
]}

机构：

[1] UNIV N CAROLINA, CHARLOTTE, NC 28223 USA

来源：

IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY | 1990年 / 13卷 / 04期

关键词：

D O I：

10.1109/33.62558

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Indium solder joint deformation has been investigated under conditions of shear loading and stress relaxation at room temperature. The deformation behavior was characterized as a function of strain, strain rate, joint thickness, and hold time. Implications of the results are discussed relative to thermal stresses and solder joint reliability in an electronic package. Work hardening during loading was found to increase with strain rate and volume fraction intermetallics. The behavior was also dependent on the amount of work hardening and recovery that occurred in the prior stress relaxation cycle. The stress-strain rate characteristics during relaxation were found to be a function of the initial strain level and the spring constant of the assembly. It was demonstrated how a material constitutive relation can be used with the assembly spring constant to calculate stress reduction with time. This procedure can be applied to any electronic assembly which undergoes stress relaxation during a constant temperature hold. © 1990 IEEE

引用

页码：929 / 939

页数：11

共 24 条

[1] THERMAL-ANALYSIS OF A MULTI-CHIP PACKAGE DESIGN [J].

DARVEAUX, R ;

HWANG, LT ;

REISMAN, A ;

TURLIK, I .

JOURNAL OF ELECTRONIC MATERIALS, 1989, 18 (02) :267-274

[2] THERMAL-STRESS ANALYSIS OF A MULTICHIP PACKAGE DESIGN [J].

DARVEAUX, R ;

TURLIK, I ;

HWANG, LT ;

REISMAN, A .

IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1989, 12 (04) :663-672

[3]

DARVEAUX R, 1990, HTESIS N CAROLINA ST

[4]

ENGELMAIER W, 1986, ISHM6984002 INT SOC

[5]

ENGELMAIER W, 1985, BRAZING SOLDERING, P40

[6]

ENKE NF, 1989, 39TH P IEEE EL COMP, P264

[7]

FOSTER FG, 1962, PAPERS SOLDERING

[8] A PHYSICALLY-BASED CONSTITUTIVE MODEL FOR METAL DEFORMATION [J].

GHOSH, AK .

ACTA METALLURGICA, 1980, 28 (11) :1443-1465

[9]

HALL PM, 1987, 37TH P IEEE EL COMP, P579

[10]

HARADA M, 1990, 40TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, VOLS 1 AND 2, P510, DOI 10.1109/ECTC.1990.122236

← 1 2 3 →