Comparison of the copper and gold wire bonding processes for LED packaging

被引：2

作者：

Chen Zhaohui ^{[1
]}

Liu Yong ^{[2
]}

Liu Sheng ^{[1
,2
,3
]}

机构：

[1] Shanghai Jiao Tong Univ, Res Inst Micro Nano Sci & Technol, Shanghai 200240, Peoples R China

[2] Huazhong Univ Sci & Technol, Wuhan Natl Lab Optoelect, Wuhan 430074, Peoples R China

[3] Huazhong Univ Sci & Technol, Sch Mech Sci & Engn, Inst Microsyst, Wuhan 430074, Peoples R China

来源：

JOURNAL OF SEMICONDUCTORS | 2011年 / 32卷 / 02期

基金：

中国国家自然科学基金; 国家高技术研究发展计划(863计划);

关键词：

LED packaging; wire bonding; copper wire; FEM;

D O I：

10.1088/1674-4926/32/2/024011

中图分类号：

O469 [凝聚态物理学];

学科分类号：

070205 ;

摘要：

Wire bonding is one of the main processes of the LED packaging which provides electrical interconnection between the LED chip and lead frame. The gold wire bonding process has been widely used in LED packaging industry currently. However, due to the high cost of gold wire, copper wire bonding is a good substitute for the gold wire bonding which can lead to significant cost saving. In this paper, the copper and gold wire bonding processes on the high power LED chip are compared and analyzed with finite element simulation. This modeling work may provide guidelines for the parameter optimization of copper wire bonding process on the high power LED packaging.

引用

页数：4

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