CRACK-PROPAGATION AND FAILURE PREDICTION IN SILICON-NITRIDE AT ELEVATED-TEMPERATURES

被引:157
作者
EVANS, AG [1 ]
WIEDERHORN, SM [1 ]
机构
[1] NBS, WASHINGTON, DC 20234 USA
关键词
D O I
10.1007/BF00550951
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
引用
收藏
页码:270 / 278
页数:9
相关论文
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