OPTIMIZATION OF OXYGEN-IMPLANTED SILICON SUBSTRATES FOR CMOS DEVICES BY ELECTRICAL CHARACTERIZATION

被引:9
作者
FOSTER, DJ
BUTLER, AL
BOLBOT, PH
ALDERMAN, JC
机构
关键词
D O I
10.1109/T-ED.1986.22494
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
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页码:354 / 360
页数:7
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共 14 条
[1]  
DAS K, 1981, I PHYS C SER, V60, P301
[2]  
Foster D. J., 1984, International Electron Devices Meeting. Technical Digest (Cat. No. 84CH2099-0), P804
[3]  
FOSTER DJ, 1983, ELECTRON LETT, V19, P648
[4]   FORMATION OF BURIED INSULATING LAYERS IN SILICON BY THE IMPLANTATION OF HIGH-DOSES OF OXYGEN [J].
HEMMENT, PLF ;
MAYDELLONDRUSZ, E ;
STEPHENS, KG ;
BUTCHER, J ;
IOANNOU, D ;
ALDERMAN, J .
NUCLEAR INSTRUMENTS & METHODS IN PHYSICS RESEARCH, 1983, 209 (MAY) :157-164
[5]  
HEMMENT PLF, 1983, P ISIAT KYOTO
[6]   CMOS DEVICES FABRICATED ON BURIED SIO2 LAYERS FORMED BY OXYGEN IMPLANTATION INTO SILICON [J].
IZUMI, K ;
DOKEN, M ;
ARIYOSHI, H .
ELECTRONICS LETTERS, 1978, 14 (18) :593-594
[7]  
IZUMI K, 1983, 1982 S VLSI, P10
[8]   SURFACE RESTORATION OF OXYGEN-IMPLANTED SILICON [J].
KIM, MJ ;
BROWN, DM ;
GARFINKEL, M .
JOURNAL OF APPLIED PHYSICS, 1983, 54 (04) :1991-1999
[9]   SURFACE SILICON CRYSTALLINITY AND ANOMALOUS COMPOSITION PROFILES OF BURIED SIO2 AND SI3N4 LAYERS FABRICATED BY OXYGEN AND NITROGEN IMPLANTATION IN SILICON [J].
MAEYAMA, S ;
KAJIYAMA, K .
JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS, 1982, 21 (05) :744-751
[10]   OPTIMIZATION OF IMPLANTATION CONDITIONS FOR THE FORMATION OF BURIED SIO2 LAYERS IN SILICON [J].
MOSSADEQ, H ;
BENNETT, RJ ;
ANAND, KV .
ELECTRONICS LETTERS, 1982, 18 (05) :215-216