THERMAL SIMULATION OF THIN-FILM INTERCONNECT FAILURE CAUSED BY HIGH-CURRENT PULSES

We have performed a quantitative analysis of the time-dependent temperature distributions in response to a high current pulse for very Large scale integrated (VLSI) metallization structures, especially for those used in field-programmable gate array (FPGA) devices with voltage programmable Links (VPL's). Simulation results are presented as pulse width versus maximum allowed current density through Al interconnects and as visualizations of the transient temperature distributions, The adiabatic approximation for modeling the current-induced heating is found to be valid only for an extremely short pulse duration (<10(-8) sec). The thermal capacity of passivation materials can effectively inhibit the rate of temperature rise in the interconnects before the thermal equilibrium is established, As a result, the instantaneous maximum current density is largely increased particularly when a passivation material with high thermal conductivity is used.