IMMERSION TIN - ITS CHEMISTRY, METALLURGY, AND APPLICATION IN ELECTRONIC PACKAGING TECHNOLOGY

被引：9
作者：
KOVAC, Z
TU, KN
机构：
来源：
IBM JOURNAL OF RESEARCH AND DEVELOPMENT | 1984年 / 28卷 / 06期
关键词：
D O I：
10.1147/rd.286.0726
中图分类号：
TP3 [计算技术、计算机技术];
学科分类号：
0812 ;
摘要：
引用
收藏
页码：726 / 734
页数：9
相关论文
共 11 条
[1]  
BAIZER MM, 1973, ORGANIC ELECTROCHEMI, P555
[2]  
Chu WK., 1978, BACKSCATTERING SPECT
[3]   SEEMAN-BOHLIN X-RAY DIFFRACTOMETER FOR THIN FILMS [J].
FEDER, R ;
BERRY, BS .
JOURNAL OF APPLIED CRYSTALLOGRAPHY, 1970, 3 (OCT1) :372-&
[4]  
FICHTER F, 1914, CHEM BER, V47, P1526
[5]   DECONVOLUTION METHOD FOR COMPOSITION PROFILING BY AUGER SPUTTERING TECHNIQUE [J].
HO, PS ;
LEWIS, JE .
SURFACE SCIENCE, 1976, 55 (01) :335-348
[6]  
Lyons E H, 1974, MODERN ELECTROPLATIN, P31
[7]  
SANTHANAM KSV, 1962, Z PHYS CHEM, V34, P312
[8]   ELECTRONIC PACKAGING EVOLUTION IN IBM [J].
SERAPHIM, DP ;
FEINBERG, I .
IBM JOURNAL OF RESEARCH AND DEVELOPMENT, 1981, 25 (05) :617-629
[9]  
THOMAS GW, 1981, COMMUNICATION
[10]  
Tu K. N., 1973, Acta Metallurgica, V21, P347, DOI 10.1016/0001-6160(73)90190-9
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