A TRANSIMPEDANCE INGAAS/INP RECEIVER OEIC BY QUASI-PLANAR TECHNOLOGY

被引：0
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作者：
LEE, WS
SPEAR, DAH
DAWE, PJG
BLAND, SW
MUN, J
机构：
来源：
FIRST INTERNATIONAL MEETING ON ADVANCED PROCESSING AND CHARACTERIZATION TECHNOLOGIES: FABRICATION AND CHARACTERIZATION OF SEMICONDUCTOR OPTOELECTRONIC DEVICES AND INTEGRATED CIRCUITS, VOLS 1 AND 2 | 1989年
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TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
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页码：A243 / A246
页数：4
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