REACTION-MECHANISM OF CHEMICAL VAPOR-DEPOSITION USING TETRAETHYLORTHOSILICATE AND OZONE AT ATMOSPHERIC-PRESSURE

被引:55
作者
KAWAHARA, T
YUUKI, A
MATSUI, Y
机构
[1] Central Research Laboratory, Mitsubishi Electric Corp, Amagasaki, Hyogo, 661
来源
JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS | 1992年 / 31卷 / 9A期
关键词
TEOS; O3; SIO2; CVD; STICKING PROBABILITY; THERMAL DECOMPOSITION; POWDER; GAS-PHASE REACTION; STEP COVERAGE; REFLOW;
D O I
10.1143/JJAP.31.2925
中图分类号
O59 [应用物理学];
学科分类号
摘要
The decomposition process of tetraethylorthosilicate (TEOS) and ozone at atmospheric pressure was measured in a closed vessel by in-situ Fourier-transform infrared absorption (FT-IR) analysis, and the changes of the deposition rate and the overall sticking probability beta of the film precursor were obtained along the flow direction in a flow-type reactor. It has been found that the film precursors are formed by TEOS decomposition with O-atoms and/or ozone in the gas phase, and that CH3CHO may be the first product, followed by the oxidation to CO2 and H2O via HCHO. It is also shown that the film quality changes along the flow direction, that is, O-H bonds in the film decrease and the beta-value increases as the reaction proceeds. These results may show that there are several kinds of precursors, and the sticky (unstable) precursors become dominant in the later stages.
引用
收藏
页码:2925 / 2930
页数:6
相关论文
共 18 条
[1]   DEPOSITION OF SILICON DIOXIDE FILMS AT REDUCED PRESSURE [J].
ADAMS, AC ;
CAPIO, CD .
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1979, 126 (06) :1042-1046
[2]   ACTIVATION-ENERGIES OF ADDITION OF O(P-3)ATOMS TO OLEFINS [J].
ATKINSON, R ;
CVETANOVIC, RJ .
JOURNAL OF CHEMICAL PHYSICS, 1972, 56 (01) :432-+
[3]   MECHANISM OF THE GAS PHASE, THERMAL DECOMPOSITION OF OZONE [J].
BENSON, SW ;
AXWORTHY, AE .
JOURNAL OF CHEMICAL PHYSICS, 1957, 26 (06) :1718-1726
[4]  
DeMore W., 1969, INT J CHEM KINET, V1, P209, DOI 10.1002/kin
[5]   DECOMPOSITION CHEMISTRY OF TETRAETHOXYSILANE [J].
DESU, SB .
JOURNAL OF THE AMERICAN CERAMIC SOCIETY, 1989, 72 (09) :1615-1621
[6]   SILICON DIOXIDE DEPOSITION BY ATMOSPHERIC-PRESSURE AND LOW-TEMPERATURE CVD USING TEOS AND OZONE [J].
FUJINO, K ;
NISHIMOTO, Y ;
TOKUMASU, N ;
MAEDA, K .
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1990, 137 (09) :2883-2887
[7]   A STUDY ON THE BEHAVIOR OF SIO2 FILM PRECURSORS WITH TRENCH DEPOSITION METHOD FOR SIH4/O2 LOW-PRESSURE CHEMICAL VAPOR-DEPOSITION [J].
KAWAHARA, T ;
YUUKI, A ;
MATSUI, Y .
JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS BRIEF COMMUNICATIONS & REVIEW PAPERS, 1991, 30 (03) :431-436
[8]   DETERMINATION OF SURFACE-REACTION RATE-CONSTANT BY USING MICRO-TRENCH METHOD IN APCVD [J].
KIM, HJ ;
EGASHIRA, Y ;
KOMIYAMA, H .
KAGAKU KOGAKU RONBUNSHU, 1991, 17 (06) :1175-1178
[9]  
KOTANI H, 1989, 1989 INTERNATIONAL ELECTRON DEVICES MEETING, TECHNICAL DIGEST, P669
[10]  
MATSUDA T, 1989, 1989 P S DRY PROC TO, P163