THERMAL CONDUCTION MODULE - A HIGH-PERFORMANCE MULTILAYER CERAMIC PACKAGE

被引：112

作者：

BLODGETT, AJ

BARBOUR, DR

机构：

来源：

IBM JOURNAL OF RESEARCH AND DEVELOPMENT | 1982年 / 26卷 / 01期

关键词：

D O I：

10.1147/rd.261.0030

中图分类号：

TP3 [计算技术、计算机技术];

学科分类号：

0812 ;

摘要：

引用

页码：30 / 36

页数：7

共 9 条

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