TOPOGRAPHICAL LIMITATIONS TO THE METALLIZATION OF VERY LARGE-SCALE INTEGRATED STRUCTURES BY BIAS SPUTTERING - EXPERIMENTS AND COMPUTER-SIMULATIONS

被引：9
作者：
BADER, HP
LARDON, MA
机构：
来源：
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B | 1986年 / 4卷 / 05期
关键词：
D O I：
10.1116/1.583482
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
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页码：1192 / 1194
页数：3
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